The dicing saw uses a high speed spindle with a thin diamond blade to dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and many other types of material.The blade is cooled with DIW water when spinning.

• Materials allowed: everything which is not considered as contaminating within NanoLab rules, sample size can’t exceed 152.4 mm (6”) in diameter.
• Spindle Type:Air BearingsMaximum
• Spindle Speed:Max 30,000 RPM
• Vertical Axis Travel: 20.1 mm (0.79”)