The Deep Silicon Etcher (DRIE) is a tool to etch silicon. It makes use of the Bosch-process where etch steps and side wall passivation steps alternate. C4F8 gas is used to create a passivation layer (side wall protection) and SF6 is used to etch. It is a technique that is very suitable to create deep anisotropic features with a high aspect ratio.

More information will follow soon and the first user trainings are planned to start in August 2024.